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    SEMICONDUCTOR PACKAGE
    2.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220367553A1

    公开(公告)日：2022-11-17

    申请号：US17745010

    申请日：2022-05-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyungkyu KIM ,  Dong-Hun LEE ,  Woonbae KIM ,  Daeho LEE ,  Jungpil LEE

    IPC: H01L27/146

    Abstract: A semiconductor package including a substrate including a through hole, an image sensor structure on the substrate, and a first transparent substrate on the substrate and spaced apart from the image sensor structure may be provided. The image sensor structure includes a logic chip on the substrate, a first sensing chip on an active surface of the logic chip, and a second sensing chip on an inactive surface of the logic chip and connected to the active surface of the logic chip through a first via that vertically penetrates the logic chip. On a bottom surface of the logic chip, at least a portion of one of the first sensing chip and the second sensing chip is in the through hole.

    TRAY SUPPORT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
    4.
    发明申请
    TRAY SUPPORT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20230127496A1

    公开(公告)日：2023-04-27

    申请号：US17974002

    申请日：2022-10-26

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sukchul PARK ,  Beommo SEONG ,  Sanghoon JUNG ,  Woonbae KIM ,  Jinsu PARK ,  Byounguk YOON

    IPC: H05K5/02 ,  H04B1/3818

    Abstract: An electronic device includes a circuit board, a socket on the circuit board and electrically connected to the circuit board, and a tray removably insertable into the socket from outside the electronic device, the tray including a body portion, a first protrusion extended from the body portion, and a second protrusion extended from the body and spaced apart from the first protrusion. The socket includes a detection portion which is engageable with the first protrusion of the tray and detects insertion of the tray in the socket, together with the circuit board, and a supporting portion which is engageable with the second protrusion of the tray. The tray which is inserted into the socket disposes the first protrusion contacting the detection portion, and a portion of the tray corresponding to the second protrusion supported by the supporting portion.

    CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
    5.
    发明公开
    CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME 审中-公开

    公开(公告)号：US20240162213A1

    公开(公告)日：2024-05-16

    申请号：US18376467

    申请日：2023-10-04

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yechung CHUNG ,  Woonbae KIM ,  Jeongkyu HA

    IPC: H01L25/18 ,  H01L23/552 ,  H10K59/90

    CPC classification number: H01L25/18 ,  H01L23/552 ,  H10K59/90 ,  H01L23/5387

    Abstract: A display apparatus includes a silicon substrate including a first surface and a second surface opposite thereto and including an opaque material, a display panel disposed on the first surface of the silicon substrate, a base film including a third surface and a fourth surface opposite thereto, the fourth surface having a portion facing the first surface of the silicon substrate, a display driving chip mounted on the base film, a connector disposed on a portion of the third surface of the base film, and a driving printed circuit board (PCB) electrically connected with the base film, wherein the silicon substrate corresponds to the base film in a one-to-one relationship, and a length of an edge of the base film overlapping the silicon substrate is about 90% of a length of an edge of the silicon substrate parallel to the edge of the base film.

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