Invention Application
- Patent Title: PIEZOELECTRIC PACKAGE-INTEGRATED TEMPERATURE SENSING DEVICES
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Application No.: US15199907Application Date: 2016-06-30
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Publication No.: US20180003569A1Publication Date: 2018-01-04
- Inventor: Feras EID , Sasha N. OSTER , Georgios C. DOGIAMIS , Thomas L. SOUNART , Adel A. ELSHERBINI , Shawna M. LIFF , Johanna M. SWAN
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G01K11/26
- IPC: G01K11/26 ; H01L41/09 ; H01L41/047

Abstract:
Embodiments of the invention include a temperature sensing device that includes a base structure that is positioned in proximity to a cavity of an organic substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure. The input transducer includes a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer. The output transducer includes a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.
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