Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US15643458Application Date: 2017-07-06
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Publication No.: US20180017741A1Publication Date: 2018-01-18
- Inventor: Hsin-Ying HO , Ying-Chung CHEN , Lu-Ming LAI
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H01L33/48 ; H01L25/16 ; H01L31/0203 ; B29C43/36 ; H01S5/022 ; B29C33/00 ; B29C35/08

Abstract:
An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module further includes a first light transmission element disposed on the first opening and a second light transmission element disposed on the second opening. A first opaque layer is disposed on the first light transmission element, the first opaque layer defining a first aperture, and a second opaque layer disposed on the second light transmission element, the second opaque layer defining a second aperture.
Information query