Embodiments of methods and apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a base having a first support surface designed to support a substrate having a given width; a plurality of arcuate slots formed through the base; a corresponding plurality of lift pins disposed through the arcuate slots, wherein the lift pins are rotationally and vertically movable with respect to the base; and a cover plate disposed on but not coupled to the base to cover the first support surface, wherein the cover plate has a diameter greater than the given width, and wherein the cover plate includes a second support surface designed to support a substrate having the given width.