Invention Application
- Patent Title: PATTERN FORMATION METHOD AND ELECTRONIC DEVICE MANUFACTURED USING SAME
-
Application No.: US15551736Application Date: 2016-02-23
-
Publication No.: US20180039179A1Publication Date: 2018-02-08
- Inventor: Toshihiko MURAI , Kenji HARA , Masatomi IRISAWA
- Applicant: ADEKA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADEKA CORPORATION
- Current Assignee: ADEKA CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2015-037451 20150226
- International Application: PCT/JP2016/055281 WO 20160223
- Main IPC: G03F7/11
- IPC: G03F7/11 ; G03F7/20 ; G03F7/32 ; G03F7/16 ; G03F7/095 ; G03F7/039

Abstract:
Provided are: a pattern-forming method by which a laminate that has excellent interlayer adhesion of a resist film, yields a high-definition pattern and exhibits excellent gas barrier properties and high solvent resistance is obtained; and an electronic device produced by the same. The pattern-forming method includes: the step (1) of forming a film using a composition on a support; the exposure step (2) of irradiating a prescribed part of the thus formed film with an active energy ray to modify the developability of the prescribed part; and the development step (3) of developing the film to obtain a pattern, wherein, a plurality of compositions that differ in solubility to a developing solution are used as the composition, and the resulting pattern has a multilayer structure.
Public/Granted literature
- US10386721B2 Pattern formation method and electronic device manufactured using same Public/Granted day:2019-08-20
Information query
IPC分类: