公开(公告)号：US20220137507A1

公开(公告)日：2022-05-05

申请号：US17425308

申请日：2020-01-22

Applicant: ADEKA CORPORATION

Inventor： Toshihiko MURAI ,  Shohei FUJITA ,  Junya MIYAKE ,  Izumi MATSUI ,  Konomi OTSUKA

IPC: G03F7/004 ,  C07C309/73 ,  C07C309/65 ,  G03F7/039 ,  G03F7/038

Abstract: A compound represented by formula (A) exhibits excellent balance between acid generation sensitivity and capability of providing a composition with reduced discoloration. In formula (A), R1, R11, R12, R13, R14, R15, R16, R17, and n are as defined in the description. R1 is preferably an optionally substituted aliphatic hydrocarbon group having 1 to 20 carbon atoms or an optionally substituted aromatic hydrocarbon group having 6 to 20 carbon atoms.

公开(公告)号：US20180039179A1

公开(公告)日：2018-02-08

申请号：US15551736

申请日：2016-02-23

Applicant: ADEKA CORPORATION

Inventor： Toshihiko MURAI ,  Kenji HARA ,  Masatomi IRISAWA

IPC: G03F7/11 ,  G03F7/20 ,  G03F7/32 ,  G03F7/16 ,  G03F7/095 ,  G03F7/039

CPC classification number: G03F7/11 ,  G03F7/0035 ,  G03F7/0226 ,  G03F7/0236 ,  G03F7/027 ,  G03F7/038 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/095 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/32 ,  G03F7/322 ,  G03F7/325 ,  G03F7/40

Abstract: Provided are: a pattern-forming method by which a laminate that has excellent interlayer adhesion of a resist film, yields a high-definition pattern and exhibits excellent gas barrier properties and high solvent resistance is obtained; and an electronic device produced by the same. The pattern-forming method includes: the step (1) of forming a film using a composition on a support; the exposure step (2) of irradiating a prescribed part of the thus formed film with an active energy ray to modify the developability of the prescribed part; and the development step (3) of developing the film to obtain a pattern, wherein, a plurality of compositions that differ in solubility to a developing solution are used as the composition, and the resulting pattern has a multilayer structure.