Invention Application
- Patent Title: WIRE EMBEDDING SYSTEM WITH A CURVED DELIVERY PATH
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Application No.: US15695828Application Date: 2017-09-05
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Publication No.: US20180070453A1Publication Date: 2018-03-08
- Inventor: David Espalin , Ryan Wicker , Alfonso Fernandez , Jorge Ramirez , Jose Motta
- Applicant: The Board of Regents, The University of Texas System
- Main IPC: H05K3/10
- IPC: H05K3/10 ; B33Y50/02 ; H05K3/00 ; H05K1/11 ; H05K1/02
Abstract:
A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.
Public/Granted literature
- US11317515B2 Wire embedding system with a curved delivery path Public/Granted day:2022-04-26
Information query
