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Patent Agency Ranking
公开(公告)号：US11317515B2
公开(公告)日：2022-04-26
申请号：US15695828
申请日：2017-09-05
Inventor： David Espalin , Ryan Wicker , Alfonso Fernandez , Jorge Ramirez , Jose Motta
Abstract: A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.
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公开(公告)号：US20180043618A1
公开(公告)日：2018-02-15
申请号：US15555468
申请日：2016-02-29
Inventor： Corey Shemelya , David Espalin , Eric MacDonald , Ryan Wicker
IPC: B29C64/314 , B33Y70/00 , B33Y30/00 , B29C64/112 , B33Y10/00
CPC classification number: B29C64/314 , B29C64/00 , B29C64/112 , B29C70/82 , B29C70/88 , B29C70/885 , B29K2069/00 , B29K2705/10 , B33Y10/00 , B33Y30/00 , B33Y70/00 , B33Y80/00 , H05K3/4664
Abstract: An embedded material and an embedding apparatus and method. A compatible solute can be dissolved in a solvent. The object to be embedded can be coated with the solvent/plastic solution using, for example, addition and/or condensation polymerization. The solvent can be removed. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the aid of ultrasonic embedding, thermal energy, joule heating, and/or the use of adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the addition of ultrasonic embedding, thermal energy, joule heating, and/or adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate.
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公开(公告)号：US10913202B2
公开(公告)日：2021-02-09
申请号：US15559423
申请日：2016-03-14
Inventor： David Espalin , Eric MacDonald , Ryan B. Wicker
IPC: B29C64/118 , B33Y10/00 , B29C70/70 , B29C64/209 , B29C64/336 , B29C64/165 , B33Y30/00
Abstract: Methods, systems, and devices for the manufacture of 3D printed components with structurally integrated metal objects using an additive manufacturing system enhanced with a range of possible secondary embedding processes. One or more layers of a three-dimensional substrate can be created by depositing a substrate, and then one or more 3D printed components can be configured on the substrate with one or more metal objects using additive manufacturing enhanced by one or more secondary embedding processes.
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公开(公告)号：US20180079131A1
公开(公告)日：2018-03-22
申请号：US15559423
申请日：2016-03-14
Inventor： David Espalin , Eric MacDonald , Ryan B. Wicker
IPC: B29C64/106 , B33Y10/00 , B33Y30/00 , B29C64/20
CPC classification number: B29C64/106 , B29C64/20 , B29C70/70 , B33Y10/00 , B33Y30/00
Abstract: Methods, systems, and devices for the manufacture of 3D printed components with structurally integrated metal objects using an additive manufacturing system enhanced with a range of possible secondary embedding processes. One or more layers of a three-dimensional substrate can be created by depositing a substrate, and then one or more 3D printed components can be configured on the substrate with one or more metal objects using additive manufacturing enhanced by one or more secondary embedding processes.
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公开(公告)号：US20180070453A1
公开(公告)日：2018-03-08
申请号：US15695828
申请日：2017-09-05
Inventor： David Espalin , Ryan Wicker , Alfonso Fernandez , Jorge Ramirez , Jose Motta
CPC classification number: H05K3/103 , B29C70/82 , B33Y10/00 , B33Y30/00 , B33Y50/02 , H05K1/0284 , H05K1/119 , H05K3/0014 , H05K2201/026 , H05K2201/0323 , H05K2203/0195 , H05K2203/1105 , H05K2203/163
Abstract: A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.
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