Invention Application
- Patent Title: ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING THE SAME
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Application No.: US15692495Application Date: 2017-08-31
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Publication No.: US20180082848A1Publication Date: 2018-03-22
- Inventor: Paul Frank , Gretchen Adema , Thomas Bertaud , Michael Ehmann , Eric Graetz , Kamil Karlovsky , Evelyn Napetschnig , Werner Robl , Tobias Schmidt , Joachim Seifert , Frank Wagner , Stefan Woehlert
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102016117826.8 20160921
- Main IPC: H01L21/285
- IPC: H01L21/285 ; H01L23/00 ; H01L29/861
Abstract:
An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.
Public/Granted literature
- US10741402B2 Electronic device, electronic module and methods for fabricating the same Public/Granted day:2020-08-11
Information query
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