Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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Application No.: US15710017Application Date: 2017-09-20
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Publication No.: US20180085769A1Publication Date: 2018-03-29
- Inventor: Go Ayabe , Minoru Tashiro , Kunihiko Fujimoto
- Applicant: Tokyo Electron Limited
- Priority: JP2016-187350 20160926
- Main IPC: B05B13/04
- IPC: B05B13/04 ; B05B13/02 ; B05D1/02

Abstract:
A substrate processing apparatus according to the present disclosure includes a holding unit, a nozzle, a driving unit, and a controller. The holding unit holds a substrate. The nozzle supplies a processing liquid to the substrate held on the holding unit. The driving unit moves the nozzle. The controller controls the driving unit, so as to move the nozzle while supplying the processing liquid to the substrate from the nozzle. Further, the controller controls the driving unit based on recipe information including step information including positions of first and second points above the substrate, total time for moving the nozzle between the first and second points, and a moving speed of the nozzle, so as to cause reciprocation of the nozzle.
Public/Granted literature
- US10668494B2 Substrate processing apparatus and substrate processing method Public/Granted day:2020-06-02
Information query
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