公开(公告)号：US10043692B2

公开(公告)日：2018-08-07

申请号：US15252364

申请日：2016-08-31

Applicant: TOKYO ELECTRON LIMITED

Inventor： Go Ayabe ,  Kouji Takuma

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67265 ,  H01L21/67781

Abstract: A substrate processing apparatus includes a substrate processing device, a substrate accommodation-status detection device, a substrate-transport device including a first substrate-transport sub-device which unloads substrates from a carrier and a second substrate-transport sub-device which unloads the substrates from the carrier, a control device including processing circuitry which controls the first and second substrate-transport sub-devices based on detection result of the substrate accommodation-status detection device. The processing circuitry of the control device determines a selection, based on the result of the substrate accommodation-status detection device, between a process in which the processing circuitry of the control device simultaneously drives the first and second substrate-transport sub-devices such that the first and second substrate-transport sub-devices simultaneously unload the substrates from the carrier and a process in which the processing circuitry of the control device drives only the second substrate-transport sub-device such that only the second substrate-transport sub-device unloads the substrates from the carrier.

公开(公告)号：US20170028450A1

公开(公告)日：2017-02-02

申请号：US15209982

申请日：2016-07-14

Applicant: Tokyo Electron Limited

Inventor： Kazuya Goda ,  Yoshifumi Amano ,  Nobuya Yamamoto ,  Go Ayabe

IPC: B08B13/00 ,  B08B3/04

CPC classification number: B08B13/00 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/6708

Abstract: A liquid processing apparatus includes a plurality of liquid processing units, a plurality of individual exhaust paths, a common exhaust path, a first outside air intake section, a first regulation valve, a second outside air intake section, and a second regulation valve. The liquid processing units perform a liquid processing on a processing target object. An exhaust gas from an inside of the liquid processing unit flows in the individual exhaust paths. The exhaust gas from the individual exhaust paths flows in the common exhaust path. The first outside air intake section is formed at the most upstream side to introduce outside air. The first regulation valve is provided in the first outside air intake section. The second outside air intake section is formed at a downstream side of the common exhaust path from the connection. The second regulation valve is provided in the second outside air intake section.

Abstract translation: 液体处理装置包括多个液体处理单元，多个单独的排气路径，公共排气路径，第一外部空气进入部分，第一调节阀，第二外部空气进入部分和第二调节阀。 液体处理单元对加工对象物进行液体处理。 来自液体处理单元的内部的废气在各个排气路径中流动。 来自各个排气通道的废气在公共排气路径中流动。 第一外部空气进入部分形成在最上游侧以引入外部空气。 第一调节阀设置在第一外部空气吸入部。 第二外部空气进入部分形成在公共排气路径从连接处的下游侧。 第二调节阀设置在第二外部空气吸入部。

公开(公告)号：US11282719B2

公开(公告)日：2022-03-22

申请号：US16371286

申请日：2019-04-01

Applicant: Tokyo Electron Limited

Inventor： Go Ayabe ,  Kouji Takuma ,  Ryo Manabe ,  Jong Won Yun

IPC: H01L21/67 ,  B08B3/04 ,  H01L21/02 ,  H01L21/687

Abstract: A substrate processing apparatus 10 includes processing units 16 each configured to process a wafer W; tanks 102 and 202 each configured to store a processing liquid; processing liquid supply units 103 and 203 each configured to supply the processing liquid into the processing unit 16; drain units 110 and 210 each configured to drain the processing liquid; supplement units 112 and 212 each configured to supplement the tanks 102 and 202 with the processing liquids; and a control unit 18. The control unit 18 is configured to perform a process job by controlling the processing liquid supply units 103 and 203 and the processing unit 16 and perform, when predetermined liquid exchange conditions are met during the performing of the process job, a liquid exchange processing in parallel with the process job by controlling the drain units 110 and 210 and the supplement units 112 and 212.

公开(公告)号：US20190304811A1

公开(公告)日：2019-10-03

申请号：US16371286

申请日：2019-04-01

Applicant: Tokyo Electron Limited

Inventor： Go Ayabe ,  Kouji Takuma ,  Ryo Manabe ,  Jong Won Yun

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B3/04

Abstract: A substrate processing apparatus 10 includes processing units 16 each configured to process a wafer W; tanks 102 and 202 each configured to store a processing liquid; processing liquid supply units 103 and 203 each configured to supply the processing liquid into the processing unit 16; drain units 110 and 210 each configured to drain the processing liquid; supplement units 112 and 212 each configured to supplement the tanks 102 and 202 with the processing liquids; and a control unit 18. The control unit 18 is configured to perform a process job by controlling the processing liquid supply units 103 and 203 and the processing unit 16 and perform, when predetermined liquid exchange conditions are met during the performing of the process job, a liquid exchange processing in parallel with the process job by controlling the drain units 110 and 210 and the supplement units 112 and 212.

公开(公告)号：US20180085769A1

公开(公告)日：2018-03-29

申请号：US15710017

申请日：2017-09-20

Applicant: Tokyo Electron Limited

Inventor： Go Ayabe ,  Minoru Tashiro ,  Kunihiko Fujimoto

IPC: B05B13/04 ,  B05B13/02 ,  B05D1/02

CPC classification number: B05B13/0405 ,  B05B13/0228 ,  B05B14/00 ,  B05D1/02 ,  H01L21/06 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67253 ,  H01L21/67259

Abstract: A substrate processing apparatus according to the present disclosure includes a holding unit, a nozzle, a driving unit, and a controller. The holding unit holds a substrate. The nozzle supplies a processing liquid to the substrate held on the holding unit. The driving unit moves the nozzle. The controller controls the driving unit, so as to move the nozzle while supplying the processing liquid to the substrate from the nozzle. Further, the controller controls the driving unit based on recipe information including step information including positions of first and second points above the substrate, total time for moving the nozzle between the first and second points, and a moving speed of the nozzle, so as to cause reciprocation of the nozzle.

公开(公告)号：US11538700B2

公开(公告)日：2022-12-27

申请号：US16878040

申请日：2020-05-19

Applicant: Tokyo Electron Limited

Inventor： Go Ayabe

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687 ,  B08B3/08 ,  B65G47/90

Abstract: There is provided a substrate processing apparatus, including: a mounting part on which a carrier having a plurality of slots capable of accommodating a plurality of substrates is mounted; a transfer part configured to load and unload the substrates to and from the plurality of slots based on a reference accommodation position set in the mounting part; a detection part configured to detect a position of each of the plurality of substrates accommodated in the plurality of slots; and a correction part configured to correct the reference accommodation position based on port accumulation information in which detection results obtained by the detection part from a plurality of carriers which has been mounted on the mounting part in the past are accumulated.

公开(公告)号：US10668494B2

公开(公告)日：2020-06-02

申请号：US15710017

申请日：2017-09-20

Applicant: Tokyo Electron Limited

Inventor： Go Ayabe ,  Minoru Tashiro ,  Kunihiko Fujimoto

IPC: H01L21/06 ,  B05B13/04 ,  H01L21/67 ,  B05B13/02 ,  B05D1/02 ,  B05B14/00

Abstract: A substrate processing apparatus according to the present disclosure includes a holding unit, a nozzle, a driving unit, and a controller. The holding unit holds a substrate. The nozzle supplies a processing liquid to the substrate held on the holding unit. The driving unit moves the nozzle. The controller controls the driving unit, so as to move the nozzle while supplying the processing liquid to the substrate from the nozzle. Further, the controller controls the driving unit based on recipe information including step information including positions of first and second points above the substrate, total time for moving the nozzle between the first and second points, and a moving speed of the nozzle, so as to cause reciprocation of the nozzle.

公开(公告)号：US10046372B2

公开(公告)日：2018-08-14

申请号：US15209982

申请日：2016-07-14

Applicant: Tokyo Electron Limited

Inventor： Kazuya Goda ,  Yoshifumi Amano ,  Nobuya Yamamoto ,  Go Ayabe

IPC: B08B13/00 ,  B08B3/04 ,  H01L21/67

Abstract: A liquid processing apparatus includes a plurality of liquid processing units, a plurality of individual exhaust paths, a common exhaust path, a first outside air intake section, a first regulation valve, a second outside air intake section, and a second regulation valve. The liquid processing units perform a liquid processing on a processing target object. An exhaust gas from an inside of the liquid processing unit flows in the individual exhaust paths. The exhaust gas from the individual exhaust paths flows in the common exhaust path. The first outside air intake section is formed at the most upstream side to introduce outside air. The first regulation valve is provided in the first outside air intake section. The second outside air intake section is formed at a downstream side of the common exhaust path from the connection. The second regulation valve is provided in the second outside air intake section.