Invention Application
- Patent Title: CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE
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Application No.: US15705492Application Date: 2017-09-15
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Publication No.: US20180086946A1Publication Date: 2018-03-29
- Inventor: Akira HIRAO , Ryo MORIOKA
- Applicant: NITTO DENKO CORPORATION
- Priority: JP2016-190595 20160929
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09J9/02 ; C09J11/04

Abstract:
Provided is a conductive pressure-sensitive adhesive tape having high flexibility. The conductive pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer arranged on at least one surface side of the base material, in which the tape has a total thickness of 30 μm or less.
Public/Granted literature
- US10329457B2 Conductive pressure-sensitive adhesive tape Public/Granted day:2019-06-25
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