Invention Grant
- Patent Title: Conductive pressure-sensitive adhesive tape
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Application No.: US15705492Application Date: 2017-09-15
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Publication No.: US10329457B2Publication Date: 2019-06-25
- Inventor: Akira Hirao , Ryo Morioka
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Hauptman Ham, LLP
- Priority: JP2016-190595 20160929
- Main IPC: B32B7/02
- IPC: B32B7/02 ; C09J11/04 ; C09J9/02 ; C09J7/38 ; C09J7/28 ; C08K3/08 ; C08K7/18 ; C08K9/02
Abstract:
Provided is a conductive pressure-sensitive adhesive tape having high flexibility. The conductive pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer arranged on at least one surface side of the base material, in which the tape has a total thickness of 30 μm or less.
Public/Granted literature
- US20180086946A1 CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE Public/Granted day:2018-03-29
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