Invention Application
- Patent Title: APPARATUS FOR MICRO PICK AND BOND
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Application No.: US15283102Application Date: 2016-09-30
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Publication No.: US20180096977A1Publication Date: 2018-04-05
- Inventor: Khaled AHMED , Kunjal ShyamKumar PARIKH , Peter CHANG
- Applicant: Intel Corporation
- Main IPC: H01L25/13
- IPC: H01L25/13 ; H01L25/00 ; H01L23/00

Abstract:
Embodiments of the invention include systems and methods for transferring micro LEDs. In an embodiment, the system for transferring micro LEDs, may include a donor substrate bank that is capable of supporting a plurality of donor substrates on which a plurality of micro LEDs are formed. In an embodiment, the donor substrate bank is moveable in the X, Y, and Z directions. In an embodiment, the system may also include a host substrate table that is capable of supporting a host substrate. The host substrate may include a plurality of segments. In an embodiment, the host substrate table is moveable in the X, Y, and Z directions. Embodiments of the invention may also include an array of macro transfer heads. In an embodiment, each macro transfer head may include a plurality of micro transfer heads.
Public/Granted literature
- US10217729B2 Apparatus for micro pick and bond Public/Granted day:2019-02-26
Information query
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