公开(公告)号：US20240230516A9

公开(公告)日：2024-07-11

申请号：US17973316

申请日：2022-10-25

Applicant: Intel Corporation

Inventor： Khaled AHMED

IPC: G01N19/04

CPC classification number: G01N19/04

Abstract: This disclosure describes systems, methods, and devices related to bond strength measurement. A device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. The device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.

公开(公告)号：US20200043901A1

公开(公告)日：2020-02-06

申请号：US16053559

申请日：2018-08-02

Applicant: Intel Corporation

Inventor： Khaled AHMED ,  Anup PANCHOLI

IPC: H01L25/075 ,  H01L27/12 ,  H01L33/06 ,  H01L33/08 ,  H01L33/24 ,  H01L33/32 ,  H01L33/42 ,  H01L33/46 ,  H01L33/62 ,  B41M5/24 ,  B41F16/00

Abstract: Embodiments disclosed herein include micro-light emitting diode (LED) displays and methods of forming such micro-LED displays. In an embodiment, a micro-light emitting diode (LED) display panel includes a display backplane substrate having a dielectric layer. In an embodiment, a plurality of electrical contacts are positioned below a first surface of the dielectric layer. In an embodiment a plurality of micro-LED pixel elements, are affixed to corresponding ones of the plurality of contacts.

公开(公告)号：US20190355784A1

公开(公告)日：2019-11-21

申请号：US15985571

申请日：2018-05-21

Applicant: Intel Corporation

Inventor： Khaled AHMED

IPC: H01L27/15 ,  H01L33/24 ,  H01L33/62 ,  H01L33/32 ,  H01L33/00 ,  H01L25/16

Abstract: Pixel architectures for low power micro light-emitting diode displays are described. In an example, a micro light emitting diode pixel structure includes a substrate having a plurality of conductive interconnect structures in a first dielectric layer thereon. A plurality of micro light emitting diode devices is in a second dielectric layer above the first dielectric layer, individual ones of the plurality of micro light emitting diode devices electrically coupled to a corresponding one of the plurality of conductive interconnect structures. The plurality of micro light emitting diode devices includes an orange micro light emitting diode device, a green micro light emitting diode device, and a blue micro light emitting diode device. A transparent conducting oxide layer is disposed on the plurality of micro light emitting diode devices and on the second dielectric layer.

公开(公告)号：US20240133799A1

公开(公告)日：2024-04-25

申请号：US17973316

申请日：2022-10-24

Applicant: Intel Corporation

Inventor： Khaled AHMED

IPC: G01N19/04

CPC classification number: G01N19/04

Abstract: This disclosure describes systems, methods, and devices related to bond strength measurement. A device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. The device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.

公开(公告)号：US20200035837A1

公开(公告)日：2020-01-30

申请号：US16049394

申请日：2018-07-30

Applicant: Intel Corporation

Inventor： Khaled AHMED

IPC: H01L29/786 ,  H01L29/20 ,  H01L27/12 ,  H01L27/15

Abstract: Low temperature thin film transistors and micro light-emitting diode displays having low temperature thin film transistors are described. In an example, an integrated circuit structure includes a gate electrode on an insulator structure. A channel material layer is over the gate electrode and extends beyond a first side and a second side of the gate electrode. The channel material layer includes a crystalline Group III-P material. A first conductive contact is on a portion of the channel material layer extending beyond the first side of the gate electrode. A second conductive contact is on a portion of the channel material layer extending beyond the second side of the gate electrode.

公开(公告)号：US20190355878A1

公开(公告)日：2019-11-21

申请号：US15985582

申请日：2018-05-21

Applicant: Intel Corporation

Inventor： Khaled AHMED

IPC: H01L33/50 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/42 ,  H01L33/32 ,  H01L33/06 ,  H01L33/00 ,  H01L33/24

Abstract: Micro light-emitting diode displays having nanophosphors, and methods of fabricating micro light-emitting diode displays having nanophosphors, are described. In an example, a pixel structure includes a substrate having a plurality of conductive interconnect structures in a first dielectric layer thereon. A plurality of micro light emitting diode devices is in a second dielectric layer above the first dielectric layer, including a first blue micro light emitting diode device, a second blue micro light emitting diode device, and a green micro light emitting diode device. A transparent conducting oxide layer is disposed on the plurality of micro light emitting diode devices and on the second dielectric layer. A phosphor layer is on the transparent conducting oxide layer at a location vertically aligned with the first blue micro light emitting diode device but not at a location vertically aligned with the second blue micro light emitting diode device.

公开(公告)号：US20190296184A1

公开(公告)日：2019-09-26

申请号：US16439341

申请日：2019-06-12

Applicant: Intel Corporation

Inventor： Khaled AHMED ,  Anup PANCHOLI ,  Ali KHAKIFIROOZ

IPC: H01L33/00 ,  H01L23/00

Abstract: Micro light-emitting diode (LED) displays and assembly apparatuses are described. In an example, method of manufacturing a micro-light emitting diode (LED) display panel includes positioning a display backplane substrate in a tank or container, the display backplane substrate having microgrooves therein. The method also includes adding a fluid to the tank or container, the fluid including a suspension of light-emitting diode (LED) pixel elements therein. The method also includes moving the fluid over the display backplane substrate. The method also includes assembling LED pixel elements from the fluid into corresponding ones of the microgrooves.

公开(公告)号：US20190214529A1

公开(公告)日：2019-07-11

申请号：US16326145

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： Khaled AHMED

IPC: H01L33/32 ,  H01L33/06 ,  H01L33/18 ,  H01L33/22 ,  H01L33/00 ,  H01L27/15

CPC classification number: H01L33/32 ,  H01L25/167 ,  H01L27/153 ,  H01L27/156 ,  H01L33/007 ,  H01L33/06 ,  H01L33/18 ,  H01L33/20 ,  H01L33/22 ,  H01L33/24

Abstract: An apparatus including a red LED and monolithic multicolor LED pixel and a method of fabricating an LED device is disclosed. The method includes providing a substrate for the wafer. The method also includes forming a light emitting diode (LED) using Hydrazine to dispose above the substrate an Indium Gallium Nitride (InGaN) layer of the LED.

公开(公告)号：US20180096977A1

公开(公告)日：2018-04-05

申请号：US15283102

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Khaled AHMED ,  Kunjal ShyamKumar PARIKH ,  Peter CHANG

IPC: H01L25/13 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/13 ,  H01L21/6838 ,  H01L24/75 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/50 ,  H01L2224/75252 ,  H01L2224/7565

Abstract: Embodiments of the invention include systems and methods for transferring micro LEDs. In an embodiment, the system for transferring micro LEDs, may include a donor substrate bank that is capable of supporting a plurality of donor substrates on which a plurality of micro LEDs are formed. In an embodiment, the donor substrate bank is moveable in the X, Y, and Z directions. In an embodiment, the system may also include a host substrate table that is capable of supporting a host substrate. The host substrate may include a plurality of segments. In an embodiment, the host substrate table is moveable in the X, Y, and Z directions. Embodiments of the invention may also include an array of macro transfer heads. In an embodiment, each macro transfer head may include a plurality of micro transfer heads.

公开(公告)号：US20230317687A1

公开(公告)日：2023-10-05

申请号：US17710662

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Bhupendra KUMAR ,  Khaled AHMED ,  Andrew William KEATES ,  Jay GUPTA

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L2933/0066 ,  H01L33/62

Abstract: Embodiments disclosed herein include a display. In an embodiment, the display comprises a backplane, and circuitry on the backplane. In an embodiment, a pad with a first width is over the backplane and electrically coupled to the circuitry. In an embodiment, the pad comprises a conductive material. In an embodiment, the display further comprises a light emitting diode (LED) coupled to the pad, where the LED has a second width that is smaller than the first width.