Invention Application
- Patent Title: GLASS CERAMIC SINTERED COMPACT AND WIRING BOARD
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Application No.: US15574266Application Date: 2016-05-12
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Publication No.: US20180134613A1Publication Date: 2018-05-17
- Inventor: Hisashi KOBUKE , Yousuke FUTAMATA , Emi NINOMIYA
- Applicant: SNAPTRACK, INC
- Priority: JP2015-108744 20150528
- International Application: PCT/EP2016/060738 WO 20160512
- Main IPC: C03C14/00
- IPC: C03C14/00 ; C03C10/00 ; H05K1/03

Abstract:
[Problem] The aim of the present invention lies in providing a glass ceramic sintered compact in which dielectric loss in a high-frequency region is reduced, without any reduction in sintering density, and also in providing a wiring board employing same. [Solution] A glass ceramic sintered compact containing a glass component, a ceramic filler and a composite oxide, characterized in that the glass component is crystallized glass on which is deposited a diopside oxide crystal phase including at least Mg, Ca and Si, and the composite oxide includes at least Al and Co.
Public/Granted literature
- US10071932B2 Glass ceramic sintered compact and wiring board Public/Granted day:2018-09-11
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