公开(公告)号：US20190089044A1

公开(公告)日：2019-03-21

申请号：US16086333

申请日：2017-03-31

Applicant: SNAPTRACK, INC.

Inventor： Hisashi KOBUKE ,  Naoki SOTOMA ,  Yousuke FUTAMATA ,  Emi NINOMIYA ,  Atsushi ISHIMOTO

IPC: H01Q1/38 ,  H01L23/498 ,  H01L23/66 ,  H01L23/15 ,  H01L21/48 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K1/03 ,  H01Q9/04 ,  H01Q1/22

Abstract: [Problem] To realize high reliability and high functionalization while suppressing characteristics variation in a multilayer interconnection substrate used in a microwave or millimeter-wave band integrated with an antenna. [Resolution Means] A multilayer substrate for high frequency with an antenna element formed on a surface. The multilayer substrate for high frequency has an intermediate substrate. The intermediate substrate consists of a low-temperature co-fired glass-ceramic substrate and has intermediate insulating layers consisting of a glass-ceramic and an internal conductor formed between these intermediate insulating layers. A surface insulating layer consisting of an organic material having a dielectric constant lower than a glass-ceramic material is stacked on a surface of the intermediate substrate. An outer-side via conductor penetrating this surface insulating layer is configured by a sintered metal that forms a metallic bond with a wiring conductor in the substrate. The outer-side via conductor is formed at the same time as sintering the glass-ceramic multilayer substrate.

公开(公告)号：US20180134613A1

公开(公告)日：2018-05-17

申请号：US15574266

申请日：2016-05-12

Applicant: SNAPTRACK, INC

Inventor： Hisashi KOBUKE ,  Yousuke FUTAMATA ,  Emi NINOMIYA

IPC: C03C14/00 ,  C03C10/00 ,  H05K1/03

CPC classification number: C03C14/004 ,  C01F7/002 ,  C01G23/047 ,  C01G45/02 ,  C01G49/009 ,  C01G51/006 ,  C01P2004/62 ,  C01P2004/82 ,  C03C3/087 ,  C03C4/16 ,  C03C10/0036 ,  C03C10/0045 ,  C03C2204/00 ,  C03C2214/04 ,  C03C2214/20 ,  C03C2214/30 ,  H01B3/02 ,  H05K1/0306

Abstract: [Problem] The aim of the present invention lies in providing a glass ceramic sintered compact in which dielectric loss in a high-frequency region is reduced, without any reduction in sintering density, and also in providing a wiring board employing same. [Solution] A glass ceramic sintered compact containing a glass component, a ceramic filler and a composite oxide, characterized in that the glass component is crystallized glass on which is deposited a diopside oxide crystal phase including at least Mg, Ca and Si, and the composite oxide includes at least Al and Co.