Invention Application
- Patent Title: Backside Polisher with Dry Frontside Design and Method Using The Same
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Application No.: US15855839Application Date: 2017-12-27
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Publication No.: US20180138052A1Publication Date: 2018-05-17
- Inventor: Chih-Hung Chen , Chia-Jung Hsu , Yi-An Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L21/321
- IPC: H01L21/321 ; H01L21/683 ; H01L21/673 ; H01L21/02
Abstract:
A wafer polishing apparatus is described herein. The wafer polishing apparatus includes a polish module configured to apply air pressure to a first surface of a wafer while performing a polishing process on a second surface of the wafer. In some implementations, the polish module is further configured to perform a cleaning process and/or a drying process on the second surface of the wafer, such that the same wafer polishing apparatus is configured to perform the polishing process, the cleaning process, and/or the drying process. In some implementations, the polishing module is further configured to air seal edges of the wafer during the polishing process, the cleaning process, and/or the drying process.
Public/Granted literature
- US10391608B2 Backside polisher with dry frontside design and method using the same Public/Granted day:2019-08-27
Information query
IPC分类:
