Invention Application
- Patent Title: POWER AMPLIFICATION MODULE FOR MULTIPLE BANDS AND MULTIPLE STANDARDS
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Application No.: US15880871Application Date: 2018-01-26
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Publication No.: US20180152902A1Publication Date: 2018-05-31
- Inventor: Satoshi TANAKA , Takayuki TSUTSUI , Yusuke TANAKA , Hayato NAKAMURA , Kazuhito NAKAI
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2015-125868 20150623
- Main IPC: H04W52/52
- IPC: H04W52/52 ; H03F3/195 ; H04W72/04 ; H04L5/14 ; H04B7/26 ; H03F1/02 ; H03F3/68 ; H03F3/24 ; H04W88/06

Abstract:
Provided is a communication unit that includes first and second power-amplification modules, which can be integrated. The first power-amplification module includes a first power-amplifier for a first frequency band in a first communication scheme, a second power-amplifier for a second frequency band in the first communication scheme, a third power-amplifier for a third frequency band in a second communication scheme, a fourth power-amplifier for a fourth frequency band in the second communication scheme, a first bias circuit that generates a first bias current to the first and second power-amplifiers, and a bias current circuit that converts the first bias current into a second bias current to the third and fourth power-amplifiers. The second power-amplification module includes a fifth power-amplifier for a fifth frequency band in the first communication scheme, and a second bias circuit that generates a third bias current to the fifth power-amplifier.
Information query