Invention Application
- Patent Title: PRINTED CIRCUIT BOARD TO MOLDED COMPOUND INTERFACE
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Application No.: US15571015Application Date: 2015-07-31
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Publication No.: US20180168049A1Publication Date: 2018-06-14
- Inventor: Chien-Hua Chen , Gary G. Lutnesky , Michael W. Cumbie , Eric L. Nikkel
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2015/043064 WO 20150731
- Main IPC: H05K3/28
- IPC: H05K3/28 ; H05K1/02 ; H05K3/46 ; H05K1/18
Abstract:
A printed circuit board has a first coefficient of thermal expansion. A compound is molded about the printed circuit board. The compound has a second coefficient of thermal expansion different than the first coefficient of thermal expansion. An interface is between an edge of the printed circuit board and the compound. The interface has a third coefficient of thermal expansion between the first coefficient of thermal expansion and the second coefficient of thermal expansion.
Public/Granted literature
- US10342140B2 Printed circuit board to molded compound interface Public/Granted day:2019-07-02
Information query
