Invention Application
- Patent Title: THERMOELECTRIC MODULE
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Application No.: US15476893Application Date: 2017-03-31
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Publication No.: US20180172324A1Publication Date: 2018-06-21
- Inventor: Yu-Li LIN , Yi-Ray CHEN , Bo-Yi SUNG
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TW105141653 20161215
- Main IPC: F25B21/02
- IPC: F25B21/02 ; H01L27/16 ; H01L35/10 ; H01L35/32 ; H01L27/02 ; H01L37/00

Abstract:
A thermoelectric module includes a plurality of thermoelectric components, a first electrode and a second electrode. The thermoelectric components have the same type of semiconductor material. The first electrode includes a first parallel connection part and a first serial connection part. The plurality of thermoelectric components is electrically connected to the first parallel connection part and each of the plurality of thermoelectric components is separated from one another. The first serial connection part is configured for being electrically connected to other electrical components. The plurality of thermoelectric components is electrically connected to the second electrode and located between the first parallel connection part and the second electrode.
Public/Granted literature
- US10648708B2 Thermoelectric module Public/Granted day:2020-05-12
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