发明申请
- 专利标题: THERMOELECTRIC MODULE
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申请号: US15476893申请日: 2017-03-31
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公开(公告)号: US20180172324A1公开(公告)日: 2018-06-21
- 发明人: Yu-Li LIN , Yi-Ray CHEN , Bo-Yi SUNG
- 申请人: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 申请人地址: TW Hsinchu
- 专利权人: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人地址: TW Hsinchu
- 优先权: TW105141653 20161215
- 主分类号: F25B21/02
- IPC分类号: F25B21/02 ; H01L27/16 ; H01L35/10 ; H01L35/32 ; H01L27/02 ; H01L37/00
摘要:
A thermoelectric module includes a plurality of thermoelectric components, a first electrode and a second electrode. The thermoelectric components have the same type of semiconductor material. The first electrode includes a first parallel connection part and a first serial connection part. The plurality of thermoelectric components is electrically connected to the first parallel connection part and each of the plurality of thermoelectric components is separated from one another. The first serial connection part is configured for being electrically connected to other electrical components. The plurality of thermoelectric components is electrically connected to the second electrode and located between the first parallel connection part and the second electrode.
公开/授权文献
- US10648708B2 Thermoelectric module 公开/授权日:2020-05-12
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