发明申请
- 专利标题： MOLDING APPARATUS
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申请号： US15496262申请日： 2017-04-25
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公开(公告)号： US20180178429A1公开(公告)日： 2018-06-28
- 发明人: Yuan-Hong Sun , Wei-Sheng Lin , Yu-Sheng Chang , Yu-Hsiang Lee , Chien-Chih Chen , An-Fu Lee
- 申请人： Siliconware Precision Industries Co., Ltd.
- 优先权： TW105142680 20161222
- 主分类号： B29C45/76
- IPC分类号： B29C45/76 ; B29C70/70 ; B29C45/14 ; H01L21/67
摘要：
A molding apparatus is provided, including a mold, a measurement device configured for sensing a state of the mold, and a calibration device electrically connected to the measurement device and configured for determining a state of a sensing function of the measurement device. Therefore, the problem that the measurement device is too old to accurately sense the state of the mold is solved.
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