公开(公告)号：US20180178429A1

公开(公告)日：2018-06-28

申请号：US15496262

申请日：2017-04-25

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yuan-Hong Sun ,  Wei-Sheng Lin ,  Yu-Sheng Chang ,  Yu-Hsiang Lee ,  Chien-Chih Chen ,  An-Fu Lee

IPC: B29C45/76 ,  B29C70/70 ,  B29C45/14 ,  H01L21/67

CPC classification number: B29C45/7653 ,  B29C45/14655 ,  B29C70/40 ,  B29C70/54 ,  B29C2945/76431 ,  B29L2031/3406 ,  H01L21/67126 ,  H01L21/67253

Abstract: A molding apparatus is provided, including a mold, a measurement device configured for sensing a state of the mold, and a calibration device electrically connected to the measurement device and configured for determining a state of a sensing function of the measurement device. Therefore, the problem that the measurement device is too old to accurately sense the state of the mold is solved.