- 专利标题： COMPOSITE HEAT-DISSIPATING SUBSTRATE
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申请号： US15795992申请日： 2017-10-27
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公开(公告)号： US20180190520A1公开(公告)日： 2018-07-05
- 发明人: Hsing-Yen LIN , Pi-Cheng LAW , Po-Chao HUANG , Bo-Wei LIU , Ya-Hsin DENG , Hua-Hsin SU
- 申请人： LUXNET CORPORATION
- 优先权： TW105220109 20161230
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; F21V29/89 ; B32B9/00 ; C22C32/00
摘要：
The present invention provides a composite heat-dissipating substrate structure, comprising: a heat-dissipating substrate and a heat-conducting metal layer. The heat-dissipating substrate includes a substrate body and a socket formed on the substrate body; and the heat-conducting metal layer widely covers the socket of the substrate body and have one side formed as a loaded side on which a laser semiconductor is to be mounted and a opposite side formed as a heat-dissipating side, so that after the loaded side absorbs heat from the laser semiconductor, the heat-dissipating side reverse to the heat-conducting metal layer diffuses the heat to the heat-dissipating substrate.
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