公开(公告)号：US20180190520A1

公开(公告)日：2018-07-05

申请号：US15795992

申请日：2017-10-27

Applicant: LUXNET CORPORATION

Inventor： Hsing-Yen LIN ,  Pi-Cheng LAW ,  Po-Chao HUANG ,  Bo-Wei LIU ,  Ya-Hsin DENG ,  Hua-Hsin SU

IPC: H01L21/67 ,  F21V29/89 ,  B32B9/00 ,  C22C32/00

CPC classification number: H01L21/67103 ,  B32B9/005 ,  C22C32/0021 ,  F21V29/89 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/02476

Abstract: The present invention provides a composite heat-dissipating substrate structure, comprising: a heat-dissipating substrate and a heat-conducting metal layer. The heat-dissipating substrate includes a substrate body and a socket formed on the substrate body; and the heat-conducting metal layer widely covers the socket of the substrate body and have one side formed as a loaded side on which a laser semiconductor is to be mounted and a opposite side formed as a heat-dissipating side, so that after the loaded side absorbs heat from the laser semiconductor, the heat-dissipating side reverse to the heat-conducting metal layer diffuses the heat to the heat-dissipating substrate.

公开(公告)号：US20180248336A1

公开(公告)日：2018-08-30

申请号：US15863662

申请日：2018-01-05

Applicant: LUXNET CORPORATION

Inventor： Hsing-Yen LIN ,  Pi-Cheng LAW ,  Po-Chao HUANG ,  Bo-Wei LIU ,  Ya-Hsin DENG ,  Hua-Hsin SU

IPC: H01S5/024 ,  H01S5/022

CPC classification number: H01S5/02469 ,  H01S5/02236 ,  H01S5/02272 ,  H01S5/02476

Abstract: An assembly of semiconductor and highly thermally conductive heat-dissipating substrates includes a thermally conductive metal substrate, a supporting substrate, and a vertical heat-dissipating block. The thermally conductive metal substrate comprises a substrate body, a receiving groove in the substrate body, and a thin-layer portion at a bottom side of the receiving groove. The supporting substrate is provided in the receiving groove. The two vertically opposite sides of the supporting substrate respectively form a carrying surface for carrying a laser diode LD and a heat-dissipating surface in contact with the thin-layer portion at the bottom side of the receiving groove. The vertical heat-dissipating block is provided on a side of the thermally conductive metal substrate opposing to a side with the receiving groove.