- 专利标题： Dual PVD Chamber And Hybrid PVD-CVD Chambers
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申请号： US15863295申请日： 2018-01-05
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公开(公告)号： US20180197760A1公开(公告)日： 2018-07-12
- 发明人: Deepak Jadhav , Jallepally Ravi , Manjunatha Koppa , Vinod Konda Purathe , Sandesh Yadamane
- 申请人： Applied Materials, Inc.
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01J37/32 ; H01L21/677 ; H01L21/687
摘要：
Processing platforms comprising a central transfer station having at least one robot and a dual chamber processing chamber connected to a side of the central transfer station through a gate valve are described. The dual chamber processing chamber comprises a first processing volume and a second processing volume connected to a shared vacuum pump.
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