- 专利标题： HANDLING THIN WAFER DURING CHIP MANUFACTURE
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申请号： US15897654申请日： 2018-02-15
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公开(公告)号： US20180233470A1公开(公告)日： 2018-08-16
- 发明人: Thomas Killer , Markus Brunnbauer , Marina Janker , Adolf Koller , Gabriel Maier , Andreas Mueller-Hipper , Andreas Stueckjuergen , Christine Thoms
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 优先权： DE102017103095.6 20170215
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/3065 ; H01L21/683 ; H01L21/78 ; H01L23/544
摘要：
A manufacturing method is provided which comprises forming recesses in a front side of a wafer, connecting a first temporary holding body to the front side of the recessed wafer, thereafter thinning the wafer from a back side, connecting a second temporary holding body to the back side, and thereafter removing the first temporary holding body.
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