发明申请
- 专利标题: HIGH PERFORMANCE, THERMALLY CONDUCTIVE SURFACE MOUNT (DIE ATTACH) ADHESIVES
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申请号: US15746954申请日: 2016-07-15
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公开(公告)号: US20180251663A1公开(公告)日: 2018-09-06
- 发明人: Cathy Shaw TRUMBLE , Maciej PATELKA , Noriyuki SAKAI , Nicholas C. KRASCO
- 申请人: NAMICS CORPORATION
- 申请人地址: JP Niigata-shi, Niigata
- 专利权人: NAMICS CORPORATION
- 当前专利权人: NAMICS CORPORATION
- 当前专利权人地址: JP Niigata-shi, Niigata
- 国际申请: PCT/JP2016/003363 WO 20160715
- 主分类号: C09J183/04
- IPC分类号: C09J183/04 ; C09J11/04 ; C08K3/08
摘要:
A composition including (a) 20 to 85 wt % of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt % of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt % of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane; and (iii) 0.5 to 12 wt % of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt % of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.
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