A substrate processing apparatus includes a processing liquid distributing member that partitions, by an inner wall surface, at least part of a processing liquid distribution passage communicating with a discharge port, a processing liquid supplying unit that supplies the high-temperature processing liquid having a higher temperature than a room temperature to the processing liquid distribution passage, a temperature changing unit arranged to heat or cool an outer wall surface of the processing liquid distributing member from the outside to change a temperature of the processing liquid distributing member, and a controller that executes an equilibrium temperature maintaining step of maintaining the inner wall surface of the processing liquid distributing member at a thermal equilibrium temperature by controlling the temperature changing unit in a state where no processing liquid is supplied from the processing liquid supplying unit to the processing liquid distribution passage.