- 专利标题： LIGHT-EMITTING MODULE SUBSTRATE, LIGHT-EMITTING MODULE, SUBSTRATE FOR LIGHT-EMITTING MODULE HAVING COOLER, AND PRODUCTION METHOD FOR LIGHT-EMITTING MODULE SUBSTRATE
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申请号： US15762194申请日： 2016-09-20
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公开(公告)号： US20180277729A1公开(公告)日： 2018-09-27
- 发明人: Toshiyuki Nagase , Masahito Komasaki , Wataru Iwazaki
- 申请人： MITSUBISHI MATERIALS CORPORATION
- 优先权： JP2015-187831 20150925
- 国际申请： PCT/JP2016/077686 WO 20160920
- 主分类号： H01L33/64
- IPC分类号： H01L33/64 ; B23K20/02 ; B23K35/30 ; C22C5/02 ; H01L33/62
摘要：
A light-emitting module substrate of the present invention includes a circuit layer which is formed on one surface of an insulating layer and in which a light-emitting element is mounted, and a metal layer formed of Al or an Al alloy and a heat sink which are laminated in order on the other surface side of the insulating layer. In the heat sink, Cu is present on at least a bonding surface with respect to the metal layer. The metal layer and the heat sink are subjected to solid-phase diffusion bonding on the bonding surface. The thickness of the circuit layer is 0.1 mm or less.