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公开(公告)号：US10573798B2
公开(公告)日：2020-02-25
申请号：US15759658
申请日：2016-09-26
摘要： A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are combined in pairs, are connected in series between a pair of opposing wiring substrates via the wiring substrates: electrode parts to which the thermoelectric conversion elements are connected, are formed on surfaces of ceramic substrates of the wiring substrates: among the thermoelectric conversion elements, the thermoelectric conversion element having a larger thermal expansion coefficient has the length, in a direction in which the wiring substrates face each other, that is smaller than the length, in a direction in which the wiring substrates face each other, of the thermoelectric conversion element having a smaller thermal expansion coefficient: an electrically conductive spacer is interposed between at least one of the two ends of the thermoelectric conversion element having a larger thermal expansion coefficient and the ceramic substrate of the wiring substrate.
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公开(公告)号：US20190044042A1
公开(公告)日：2019-02-07
申请号：US15759658
申请日：2016-09-26
摘要： A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are combined in pairs, are connected in series between a pair of opposing wiring substrates via the wiring substrates: electrode parts to which the thermoelectric conversion elements are connected, are formed on surfaces of ceramic substrates of the wiring substrates: among the thermoelectric conversion elements, the thermoelectric conversion element having a larger thermal expansion coefficient has the length, in a direction in which the wiring substrates face each other, that is smaller than the length, in a direction in which the wiring substrates face each other, of the thermoelectric conversion element having a smaller thermal expansion coefficient: an electrically conductive spacer is interposed between at least one of the two ends of the thermoelectric conversion element having a larger thermal expansion coefficient and the ceramic substrate of the wiring substrate.
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公开(公告)号：US20180277729A1
公开(公告)日：2018-09-27
申请号：US15762194
申请日：2016-09-20
CPC分类号： H01L33/644 , B23K1/00 , B23K20/00 , B23K20/02 , B23K35/30 , B23K35/3013 , B23K2101/40 , C22C5/02 , H01L23/12 , H01L23/13 , H01L23/36 , H01L23/40 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/8384 , H01L2933/0033 , H01L2933/0075
摘要： A light-emitting module substrate of the present invention includes a circuit layer which is formed on one surface of an insulating layer and in which a light-emitting element is mounted, and a metal layer formed of Al or an Al alloy and a heat sink which are laminated in order on the other surface side of the insulating layer. In the heat sink, Cu is present on at least a bonding surface with respect to the metal layer. The metal layer and the heat sink are subjected to solid-phase diffusion bonding on the bonding surface. The thickness of the circuit layer is 0.1 mm or less.
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公开(公告)号：US20210175401A1
公开(公告)日：2021-06-10
申请号：US16769311
申请日：2018-12-06
摘要： An insulated heat transfer substrate includes a heat transfer layer formed of aluminum or an aluminum alloy, a conductive layer provided on one surface side of the heat transfer layer, and a glass layer formed between the conductive layer and the heat transfer layer, in which the conductive layer is formed of a sintered body of silver, and a thickness of the glass layer is in a range of 5 μm or larger and 50 μm or smaller.
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5.发明申请公开(公告)号：US20210111327A1
公开(公告)日：2021-04-15
申请号：US16608469
申请日：2018-06-29
摘要： A thermoelectric conversion module includes thermoelectric conversion elements, and a first insulating circuit board provided with a first insulating layer and a first electrode part formed on one surface of the first insulating layer is disposed on one end side of the thermoelectric conversion elements. The first electrode part includes a first aluminum layer made of aluminum or an aluminum alloy, and a first sintered silver layer which is formed on a surface of the first aluminum layer on a side opposite to the first insulating layer and is formed of a sintered body of silver. The first aluminum layer has a thickness in a range of 50 μm or more and 2000 μm or less. The first sintered silver layer has a thickness of 5 μm or more and a porosity of less than 10% at least in a region where the thermoelectric conversion element is disposed.
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公开(公告)号：US20210107837A1
公开(公告)日：2021-04-15
申请号：US17044541
申请日：2019-04-01
发明人： Koya Arai , Masahito Komasaki
摘要： A method of manufacturing a ceramics-metal bonded body according to the present invention is a method of manufacturing a ceramics-metal bonded body in which a metal layer is bonded to at least one surface of a ceramics substrate, and comprises: a groove-forming step of forming a groove extending across a bonding region of a ceramics substrate to which a metal layer is bonded; and a bonding step of, after the groove-forming step, forming a metal layer by stacking, in the bonding region of the ceramics substrate, a metal plate of an aluminum or aluminum alloy with a thickness of less than or equal to 0.4 mm, via an Al—Si based brazing material foil, and bonding the metal plate to the bonding region by heating while applying load in a stacking direction.
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公开(公告)号：US20200303612A1
公开(公告)日：2020-09-24
申请号：US16084057
申请日：2017-03-17
发明人： Yoshinobu Nakada , Koya Arai , Masahito Komasaki
摘要： A magnesium-based thermoelectric conversion material includes a first layer formed of Mg2Si and a second layer formed of Mg2SixSn1-x (here, x is equal to or greater than 0 and less than 1), in which the first layer and the second layer are directly joined to each other, and within a junction surface with the first layer and in the vicinity of the junction surface, the second layer has a tin concentration transition region in which a tin concentration increases as a distance from the junction surface increases. The junction layer is regarded as a site in which a tin concentration is found to be equal to or lower than a detection limit by the measurement performed using EDX.
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公开(公告)号：US20180012685A1
公开(公告)日：2018-01-11
申请号：US15544126
申请日：2016-01-27
CPC分类号： H01C1/144 , H01C1/012 , H01C1/028 , H01C1/084 , H01C7/003 , H01C17/006 , H01C17/02 , H01C17/28
摘要： The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an Al—Si-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of −30 μm/50 mm to 700 μm/50 mm.
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公开(公告)号：US10806028B2
公开(公告)日：2020-10-13
申请号：US16616136
申请日：2018-06-11
发明人： Koya Arai , Masahito Komasaki
IPC分类号： H05K1/03 , H05K3/00 , B23K1/00 , B23K103/00 , B23K101/42
摘要： Provided is a method for manufacturing a metal-layer-joined ceramic base material board, in which at least one scribe line is formed, on each of the front and back surfaces of a ceramic base material board, along dividing lines for dividing the ceramic base material board into a plurality of ceramic boards, a metal board covering at least a portion of the dividing lines is joined to each of the front and back surface of the ceramic base material board, the metal boards are etched along the dividing lines to form a plurality of metal layers, and the plurality of metal layers are joined to each of the front and back surfaces of the ceramic base material board.
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公开(公告)号：US20200146144A1
公开(公告)日：2020-05-07
申请号：US16616136
申请日：2018-06-11
发明人： Koya Arai , Masahito Komasaki
IPC分类号： H05K1/03 , H05K3/00 , B23K1/00 , B23K103/00 , B23K101/42
摘要： Provided is a method for manufacturing a metal-layer-joined ceramic base material board, in which at least one scribe line is formed, on each of the front and back surfaces of a ceramic base material board, along dividing lines for dividing the ceramic base material board into a plurality of ceramic boards, a metal board covering at least a portion of the dividing lines is joined to each of the front and back surface of the ceramic base material board, the metal boards are etched along the dividing lines to form a plurality of metal layers, and the plurality of metal layers are joined to each of the front and back surfaces of the ceramic base material board.
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