Invention Application
- Patent Title: FLEXIBLE THERMALLY-CONDUCTIVE SHUNT
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Application No.: US15471798Application Date: 2017-03-28
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Publication No.: US20180284854A1Publication Date: 2018-10-04
- Inventor: MARK E. SPRENGER , KENAN ARIK , MICHAEL S. BRAZEL
- Applicant: Intel Corporation
- Main IPC: G06F1/20
- IPC: G06F1/20 ; F28F1/40

Abstract:
Apparatuses, systems and methods associated with a flexible thermally conductive shunt are disclosed herein. The flexible thermally conductive shunt may include a thermally conductive element, the thermally conductive element being flexible. The flexible thermally conductive shunt may further include a thermally conductive member thermally coupled to the thermally conductive element. The thermally conductive member may include a shell and a cavity. The shell may be sealed to the thermally conductive element, wherein the thermally conductive element extends through a discontinuity of the shell. The cavity may be formed at a center of the thermally conductive member and enclosed by the shell, wherein a first portion of the thermally conductive element extends within the cavity and a second portion of the thermally conductive element extends out of the thermally conductive member via the discontinuity of the shell. Other embodiments may be described and/or claimed.
Public/Granted literature
- US10321606B2 Flexible thermally-conductive shunt Public/Granted day:2019-06-11
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