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    FLEXIBLE THERMALLY-CONDUCTIVE SHUNT
    3.
    发明申请
    FLEXIBLE THERMALLY-CONDUCTIVE SHUNT 审中-公开

    公开(公告)号：US20180284854A1

    公开(公告)日：2018-10-04

    申请号：US15471798

    申请日：2017-03-28

    Applicant: Intel Corporation

    Inventor： MARK E. SPRENGER ,  KENAN ARIK ,  MICHAEL S. BRAZEL

    IPC: G06F1/20 ,  F28F1/40

    CPC classification number: H01L23/40 ,  F28F2255/02 ,  F28F2255/18 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20

    Abstract: Apparatuses, systems and methods associated with a flexible thermally conductive shunt are disclosed herein. The flexible thermally conductive shunt may include a thermally conductive element, the thermally conductive element being flexible. The flexible thermally conductive shunt may further include a thermally conductive member thermally coupled to the thermally conductive element. The thermally conductive member may include a shell and a cavity. The shell may be sealed to the thermally conductive element, wherein the thermally conductive element extends through a discontinuity of the shell. The cavity may be formed at a center of the thermally conductive member and enclosed by the shell, wherein a first portion of the thermally conductive element extends within the cavity and a second portion of the thermally conductive element extends out of the thermally conductive member via the discontinuity of the shell. Other embodiments may be described and/or claimed.

    INTEGRATED THERMAL EMI STRUCTURE FOR ELECTRONIC DEVICES
    5.
    发明申请
    INTEGRATED THERMAL EMI STRUCTURE FOR ELECTRONIC DEVICES 审中-公开
    电子设备的集成热电阻结构

    公开(公告)号：US20160192544A1

    公开(公告)日：2016-06-30

    申请号：US14583530

    申请日：2014-12-26

    Applicant: Intel Corporation

    Inventor： RUSSELL S. AOKI ,  MARK E. SPRENGER ,  HUE V. LAM ,  BRANDON COURTNEY ,  SHANTANU D. KULKARNI ,  DENICA N. LARSEN

    IPC: H05K9/00 ,  H05K7/20

    CPC classification number: H05K9/0007 ,  G06F1/203 ,  H05K7/205 ,  H05K9/005

    Abstract: In one example a electronic device comprises a housing, a circuit board comprising a plurality of heat generating components, a chassis, wherein the chassis comprises a cut-out section configured to receive the circuit board, an electromagnetic interference (EMI) shield is configured to cover the plurality of heat generating components on the circuit board and to be physically connected to the chassis, wherein the electromagnetic interference shield comprises at least one structural component. Other examples may be described.

    Abstract translation: 在一个示例中，电子设备包括壳体，包括多个发热部件的电路板，底架，其中底盘包括被配置为接收电路板的切口部分，电磁干扰（EMI）屏蔽被配置为 覆盖电路板上的多个发热部件并且物理地连接到底架，其中电磁干扰屏蔽包括至少一个结构部件。 可以描述其他示例。

    BELT DRIVEN HINGE ASSEMBLY FOR ELECTRONIC DEVICES
    6.
    发明申请
    BELT DRIVEN HINGE ASSEMBLY FOR ELECTRONIC DEVICES 有权
    皮带驱动的电子装置的铰链总成

    公开(公告)号：US20150378400A1

    公开(公告)日：2015-12-31

    申请号：US14318257

    申请日：2014-06-27

    Applicant: Intel Corporation

    Inventor： MARK E. SPRENGER ,  RUSSELL S. AOKI ,  SHAWN MCEUEN ,  MARK MACDONALD ,  DAVID PIDWERBECKI

    IPC: G06F1/16

    CPC classification number: G06F1/1681 ,  G06F1/1616 ,  H04M1/022

    Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a housing, a first shaft rotatable about a first axis, a second shaft rotatable about a second axis, a belt drive assembly to couple the first shaft to the second shaft, and a tension assembly to apply a tension to the belt drive assembly. Other examples may be described.

    Abstract translation: 在一个示例中，电子设备包括控制器，包括第一部分和第二部分的底架以及将底盘的第一部分连接到底架的第二部分的铰链组件，包括壳体，第一轴可绕 第一轴线，可围绕第二轴线旋转的第二轴线，将第一轴部连接到第二轴线的带驱动组件以及将张力施加到带驱动组件的张力组件。 可以描述其他示例。

    SMART FLEXIBLE DISPLAY
    7.
    发明申请
    SMART FLEXIBLE DISPLAY 有权
    智能柔性显示

    公开(公告)号：US20150277497A1

    公开(公告)日：2015-10-01

    申请号：US14227655

    申请日：2014-03-27

    Applicant: Intel Corporation

    Inventor： PAUL J. GWIN ,  MARK E. SPRENGER

    IPC: G06F1/16

    CPC classification number: G06F1/1652 ,  G06F1/1616 ,  G06F1/1677 ,  G06F1/1681

    Abstract: In one example an electronic device, comprises a base section and a display connectable to the base section and comprising a flexible emissive projection display (EPD) layer, and an electroactive polymer (EAP) structure coupled to the EPD layer. Other examples may be described.

    Abstract translation: 在一个示例中，电子设备包括基部和可连接到基部的显示器，并且包括柔性发射投影显示器（EPD）层和耦合到EPD层的电活性聚合物（EAP）结构。 可以描述其他示例。

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