Invention Application
- Patent Title: COPPER ALLOY MATERIAL
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Application No.: US15769024Application Date: 2016-10-11
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Publication No.: US20180291490A1Publication Date: 2018-10-11
- Inventor: Shoichiro YANO , Shinobu SATOU , Toshio SAKAMOTO
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2015-219851 20151109
- International Application: PCT/JP2016/080082 WO 20161011
- Main IPC: C22F1/08
- IPC: C22F1/08 ; C22C9/00

Abstract:
A copper alloy material has a composition including: 0.1 mass % or more and 1.5 mass % or less of Cr; 0.05 mass % or more and 0.25 mass % or less of Zr; 0.005 mass % or more and 0.10 mass % or less of P; and a Cu balance including inevitable impurities. The copper alloy material includes a Cr—Zr—P compound containing Cr, Zr and P and an area ratio of the Cr—Zr—P compound is in a range of 0.5% or more and 5.0% or less in a structure observation, and the Cr—Zr—P compound is in a form of a needle shape or a granular shape and a length a longest side of the needle shape or the granular shape is 100 μm or less.
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