- 专利标题: MOLECULARLY ENGINEERED HIGH THERMAL CONDUCTIVITY POLYMERS AND METHODS FOR MAKING THE SAME
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申请号: US16002809申请日: 2018-06-07
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公开(公告)号: US20180355233A1公开(公告)日: 2018-12-13
- 发明人: Jinsang KIM , Chen LI , Apoorv SHANKER , Kevin PIPE , Gun-Ho KIM
- 申请人: The Regents of the University of Michigan
- 申请人地址: US MI Ann Arbor
- 专利权人: The Regents of the University of Michigan
- 当前专利权人: The Regents of the University of Michigan
- 当前专利权人地址: US MI Ann Arbor
- 主分类号: C09K5/14
- IPC分类号: C09K5/14 ; C08F26/10 ; C08F20/06 ; C08K3/08 ; C08J5/18
摘要:
Methods of increasing thermal conductivity of a bulk polymer are provided. The methods include contacting a bulk polyelectrolyte polymer comprising an ionizable repeating pendant group with an aqueous liquid having a pH that ionizes the pendant group and isotropically extend the polyelectrolyte polymer to an extended non-globular chain conformation. The polyelectrolyte polymer so treated thus exhibits a thermal conductivity of greater than or equal to about 0.6 W/m·K and optionally greater than or equal to about 1 W/m·K. In other aspects, the present disclosure provides a high thermal conductivity material comprising a bulk polyelectrolyte polymer bearing a repeating charged group and having an extended non-globular chain conformation and that exhibits a thermal conductivity of greater than or equal to about 0.6 W/m·K and optionally greater than or equal to about 1 W/m·K. The high thermal conductivity material may be used in electronic devices, including as housings/encapsulation and thermal interfaces.