公开(公告)号：US20180355233A1

公开(公告)日：2018-12-13

申请号：US16002809

申请日：2018-06-07

申请人： The Regents of the University of Michigan

发明人： Jinsang KIM ,  Chen LI ,  Apoorv SHANKER ,  Kevin PIPE ,  Gun-Ho KIM

IPC分类号： C09K5/14 ,  C08F26/10 ,  C08F20/06 ,  C08K3/08 ,  C08J5/18

CPC分类号： C09K5/14 ,  B29C41/045 ,  B29C71/02 ,  B29C2071/022 ,  B29K2033/04 ,  B29K2039/06 ,  B29K2995/0013 ,  C08F20/06 ,  C08F26/10 ,  C08J5/18 ,  C08J2333/08 ,  C08J2339/06 ,  C08K3/08 ,  C08K2003/0831 ,  C08K2003/0881 ,  C08K2201/001 ,  C09D133/02 ,  C09D139/06

摘要： Methods of increasing thermal conductivity of a bulk polymer are provided. The methods include contacting a bulk polyelectrolyte polymer comprising an ionizable repeating pendant group with an aqueous liquid having a pH that ionizes the pendant group and isotropically extend the polyelectrolyte polymer to an extended non-globular chain conformation. The polyelectrolyte polymer so treated thus exhibits a thermal conductivity of greater than or equal to about 0.6 W/m·K and optionally greater than or equal to about 1 W/m·K. In other aspects, the present disclosure provides a high thermal conductivity material comprising a bulk polyelectrolyte polymer bearing a repeating charged group and having an extended non-globular chain conformation and that exhibits a thermal conductivity of greater than or equal to about 0.6 W/m·K and optionally greater than or equal to about 1 W/m·K. The high thermal conductivity material may be used in electronic devices, including as housings/encapsulation and thermal interfaces.