Invention Application
- Patent Title: ELECTROSTATIC CHUCK, A PLASMA PROCESSING APPARATUS HAVING THE SAME, AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
-
Application No.: US15864293Application Date: 2018-01-08
-
Publication No.: US20180358253A1Publication Date: 2018-12-13
- Inventor: YOUNGJIN NOH , NAMJUN KANG , EUNG-SU KIM , SEUNGBO SHIM , SANG-HO LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2017-0072701 20170609
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H02N13/00 ; H01L21/67 ; H01J37/32
Abstract:
An electrostatic chuck includes: a chuck base including a first hole; a first plate on the chuck base, wherein the first plate includes a second hole on the first hole; a first bushing in the first hole; and a porous block in the first bushing, wherein the first bushing contacts the first plate and is disposed adjacent to the porous block.
Information query
IPC分类:
