- 专利标题: SELF-ALIGNED INTERCONNECTION FOR INTEGRATED CIRCUITS
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申请号: US16111004申请日: 2018-08-23
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公开(公告)号: US20180366370A1公开(公告)日: 2018-12-20
- 发明人: Fabio Pellizzer , Antonino Rigano , Roberto Somaschini
- 申请人: Fabio Pellizzer , Antonino Rigano , Roberto Somaschini
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L45/00 ; H01L27/24 ; H01L23/522 ; H01L21/033 ; H01L21/311
摘要:
Methods and structures provide horizontal conductive lines of fine pitch and self-aligned contacts extending from them, where the contacts have at least one dimension with a more relaxed pitch. Buried hard mask materials permit self-alignment of the lines and contacts without a critical mask, such as for word-line electrode lines and word-line contacts in a memory device.
公开/授权文献
- US11049769B2 Self-aligned interconnection for integrated circuits 公开/授权日:2021-06-29
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