Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US16121467Application Date: 2018-09-04
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Publication No.: US20180374805A1Publication Date: 2018-12-27
- Inventor: Chang-Lin YEH , Jen-Chieh KAO , Chih-Yi HUANG , Fu-Chen CHU
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L43/02 ; H01L23/552
Abstract:
A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.
Public/Granted literature
- US10332849B2 Semiconductor package device and method of manufacturing the same Public/Granted day:2019-06-25
Information query
IPC分类:
