Invention Application
- Patent Title: SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
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Application No.: US16113886Application Date: 2018-08-27
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Publication No.: US20190013341A1Publication Date: 2019-01-10
- Inventor: Satoru WAKIYAMA , Taizo TAKACHI
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2013-046835 20130308
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/18 ; H01L31/041 ; H01L31/0216
Abstract:
A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.
Public/Granted literature
- US10446598B2 Semiconductor device, manufacturing method, and electronic apparatus Public/Granted day:2019-10-15
Information query
IPC分类:
