Invention Application
- Patent Title: PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Application No.: US15652249Application Date: 2017-07-18
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Publication No.: US20190027449A1Publication Date: 2019-01-24
- Inventor: Albert Wan , Chao-Wen Shih , Shou-Zen Chang , Nan-Chin Chuang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/00 ; H01L23/48 ; H01L23/31 ; H01L23/60 ; H01L21/56 ; H01L21/683 ; H01Q1/22
Abstract:
A package structure includes at least one die, an antenna element, and at least one through interlayer via. The antenna element is located on the at least one die. The at least one through interlayer via is located between the antenna element and the at least one die, wherein the antenna element is electrically connected to the at least one die through the at least one through interlayer via.
Public/Granted literature
- US10186492B1 Package structure and manufacturing method thereof Public/Granted day:2019-01-22
Information query
IPC分类:
