Invention Application
- Patent Title: Anti-Slip Substrates
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Application No.: US16156430Application Date: 2018-10-10
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Publication No.: US20190045643A1Publication Date: 2019-02-07
- Inventor: Yu-Chuan Kang , Kuan-Ting Wu
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Main IPC: H05K5/02
- IPC: H05K5/02 ; C25D13/20 ; C25D13/12 ; A45C11/00 ; A45F5/00 ; C25D13/06
Abstract:
A method is provided for modifying a layer of a plastics material containing conductive fibers. The method includes electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.
Information query
