Invention Application
- Patent Title: APPARATUS AND METHOD FOR MITIGATING SURFACE IMPERFECTIONS ON DIE BACKSIDE FILM
-
Application No.: US15767306Application Date: 2015-11-13
-
Publication No.: US20190067213A1Publication Date: 2019-02-28
- Inventor: Balu Pathangey , Mihir A. Oka , Andrew Proctor
- Applicant: INTEL CORPORATION
- Applicant Address: US CA SANTA CLARA
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA SANTA CLARA
- International Application: PCT/US15/60649 WO 20151113
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/67 ; H01L21/683 ; H01L21/78 ; H01L25/18 ; H01L25/065
Abstract:
Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.
Public/Granted literature
- US10546823B2 Apparatus and method for mitigating surface imperfections on die backside film using fluorocarbon material Public/Granted day:2020-01-28
Information query
IPC分类:
