Invention Application
- Patent Title: METHODS OF FORMING MEMORY CELLS AND SEMICONDUCTOR DEVICES
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Application No.: US16172260Application Date: 2018-10-26
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Publication No.: US20190067573A1Publication Date: 2019-02-28
- Inventor: Tsz W. Chan , D. V. Nirmal Ramaswamy , Qian Tao , Yongjun Jeff Hu , Everett A. McTeer
- Applicant: Micron Technology, Inc.
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A memory cell comprising a threshold switching material over a first electrode on a substrate. The memory cell includes a second electrode over the threshold switching material and at least one dielectric material between the threshold switching material and at least one of the first electrode and the second electrode. A memory material overlies the second electrode. The dielectric material may directly contact the threshold switching material and each of the first electrode and the second electrode. Memory cells including only one dielectric material between the threshold switching material and an electrode are disclosed. A memory device including the memory cells and methods of forming the memory cells are also described.
Public/Granted literature
- US10418554B2 Methods of forming memory cells and semiconductor devices Public/Granted day:2019-09-17
Information query
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