Invention Application
- Patent Title: SEMICONDUCTOR THIN-FILM AND MANUFACTURING METHOD THEREOF, THIN-FILM TRANSISTOR, AND DISPLAY APPARATUS
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Application No.: US15765262Application Date: 2017-09-18
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Publication No.: US20190067609A1Publication Date: 2019-02-28
- Inventor: Liangchen YAN , Xiaoguang XU , Lei WANG , Junbiao PENG , Linfeng LAN
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Applicant Address: CN Beijing CN Guangzhou, Guangdong
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Current Assignee Address: CN Beijing CN Guangzhou, Guangdong
- Priority: CN201610966561.6 20161028
- International Application: PCT/CN2017/102106 WO 20170918
- Main IPC: H01L51/05
- IPC: H01L51/05

Abstract:
A method for manufacturing a semiconductor thin film includes sequentially forming a first semiconductor layer, an intermediate layer, and a second semiconductor layer over a substrate. The first semiconductor layer and the second semiconductor layer can be one and another of an n-type semiconductor layer and a p-type semiconductor layer. At least one of the first semiconductor layer, the intermediate layer, or the second semiconductor layer is formed via a solution process. The n-type semiconductor layer can include indium oxide. The intermediate layer can include a self-assembly material. The p-type semiconductor layer can include a p-type organic semiconductor material, and can be pentacene. On the basis, a semiconductor thin film manufactured thereby, a semiconductor thin film transistor, and a display apparatus, are also disclosed.
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