Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE HAVING AN ELECTRO-MAGNETIC INTERFERENCE SHIELDING OR ELECTRO-MAGNETIC WAVE SCATTERING STRUCTURE
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Application No.: US16186305Application Date: 2018-11-09
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Publication No.: US20190081009A1Publication Date: 2019-03-14
- Inventor: Won Duck JUNG , Sang Joon LIM , Sung Mook LIM
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si Gyeonggi-do
- Priority: KR10-2017-0024540 20170224
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/482 ; H01L23/00
Abstract:
Disclosed is a semiconductor package. The semiconductor package may include a substrate a semiconductor chip mounted over a surface of the substrate such that an active surface of the semiconductor chip faces the surface of the substrate. The semiconductor chip and substrate may be configured for shielding or scattering electromagnetic waves.
Information query
IPC分类:
