- 专利标题: SUBSTRATE ROUTING AND THROUGHPUT MODELING
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申请号: US15706209申请日: 2017-09-15
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公开(公告)号: US20190086906A1公开(公告)日: 2019-03-21
- 发明人: Shyam Sunder EMANI
- 申请人: Applied Materials, Inc.
- 主分类号: G05B19/418
- IPC分类号: G05B19/418 ; H01L21/67
摘要:
Embodiments disclosed herein generally relate to methods, systems, and non-transitory computer readable medium for scheduling a substrate processing sequence in an integrated substrate processing system. A client device assigns a processing sequence to each substrate in a batch of substrates to be processed. The client device assigns a processing chamber to each process in the process sequence for each processing chamber in the integrate substrate processing system. The client device generates a processing model for the batch of substrates. The processing model defines a start time for each substrate in each processing chamber. The client device generates a timetable for the batch of semiconductor substrates based off the processing model. The client device processes the batch of substrates in accordance with the timetable.
公开/授权文献
- US10359769B2 Substrate routing and throughput modeling 公开/授权日:2019-07-23
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