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公开(公告)号:US20190086906A1
公开(公告)日:2019-03-21
申请号:US15706209
申请日:2017-09-15
发明人: Shyam Sunder EMANI
IPC分类号: G05B19/418 , H01L21/67
CPC分类号: G05B19/41885 , G05B19/41865 , G05B2219/32247 , G05B2219/42155 , G05B2219/45031 , H01L21/28185 , H01L21/67167 , H01L21/67184 , H01L21/67207 , H01L21/67276
摘要: Embodiments disclosed herein generally relate to methods, systems, and non-transitory computer readable medium for scheduling a substrate processing sequence in an integrated substrate processing system. A client device assigns a processing sequence to each substrate in a batch of substrates to be processed. The client device assigns a processing chamber to each process in the process sequence for each processing chamber in the integrate substrate processing system. The client device generates a processing model for the batch of substrates. The processing model defines a start time for each substrate in each processing chamber. The client device generates a timetable for the batch of semiconductor substrates based off the processing model. The client device processes the batch of substrates in accordance with the timetable.
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公开(公告)号:US20200012267A1
公开(公告)日:2020-01-09
申请号:US16518939
申请日:2019-07-22
发明人: Shyam Sunder EMANI
IPC分类号: G05B19/418 , H01L21/67
摘要: Embodiments disclosed herein generally relate to methods, systems, and non-transitory computer readable medium for scheduling a substrate processing sequence in an integrated substrate processing system. A client device assigns a processing sequence to each substrate in a batch of substrates to be processed. The client device assigns a processing chamber to each process in the process sequence for each processing chamber in the integrate substrate processing system. The client device generates a processing model for the batch of substrates. The processing model defines a start time for each substrate in each processing chamber. The client device generates a timetable for the batch of semiconductor substrates based off the processing model. The client device processes the batch of substrates in accordance with the timetable.
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