- 专利标题： STORAGE SYSTEM WITH INTERCONNECTED SOLID STATE DISKS
-
申请号： US15721547申请日： 2017-09-29
-
公开(公告)号： US20190102293A1公开(公告)日： 2019-04-04
- 发明人: Peng Li , Jawad B. Khan , Sanjeev N. Trika
- 申请人： Intel Corporation
- 主分类号： G06F12/06
- IPC分类号： G06F12/06 ; G05B19/045 ; G11C7/10
摘要：
An embodiment of a semiconductor package apparatus may include technology to provide a first interface between a first storage device and a host device, and provide a second interface directly between the first storage device and a second storage device. Other embodiments are disclosed and claimed.
公开/授权文献
- US10430333B2 Storage system with interconnected solid state disks 公开/授权日：2019-10-01
信息查询
