- 专利标题: MANUFACTURING METHOD FOR SILICON CARBIDE CRYSTAL
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申请号: US15864000申请日: 2018-01-08
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公开(公告)号: US20190106811A1公开(公告)日: 2019-04-11
- 发明人: Ching-Shan Lin , Jian-Hsin Lu , Chien-Cheng Liou , I-Ching Li
- 申请人: GlobalWafers Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: GlobalWafers Co., Ltd.
- 当前专利权人: GlobalWafers Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 优先权: TW106134503 20171006
- 主分类号: C30B29/36
- IPC分类号: C30B29/36 ; C30B17/00 ; C01B32/956
摘要:
A silicon carbide crystal and a manufacturing method for same are provided. A silicon carbide crystal seed used for the silicon carbide crystal has a crystal-growing surface with a surface roughness (Ra) less than 2.0 nm, and a thickness of the silicon carbide crystal seed is less than 700 μm. Therefore, the silicon carbide crystal grown from the silicon carbide crystal seed by sublimation method (which is also a PVT method) may have low basal plane dislocation (BPD) and low micropipe density (MPD).
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